India, US inks MOU on semiconductors; Will help merging into global alliances

The United States CHIPS & Science Act & India’s Semiconductor Mission in view. India and the United States will develop a collaboration framework between 2 govts on chip supply chain flexibility and diversification.

The Memorandum of Understanding (MoU). Which calls for mutual benefit R&D, talent, & skill development in the field of chips, was sign on Mar-10 in New Delhi during the 5th Ministerial level meeting of the India-United States Commercial Dialogue.


Following the meeting, both parties issued a joint statement in which. They expressed support for the recently launched India-United States initiative on ICET.

Which strengthens & broadens the joint venture in technology between our 2 countries govts, corporations, and academic institutions.

India and the United States confirmed their intention to hold a mid-year review before the end of 2023. To be chaired by senior govt officials from both countries.